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Robots

Epitaxial growth

Multi- and Single Wafer systems

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Front end technology

Front end line for 2", 3" and 100mm

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Device design and simulation

Physical simulation, Chiplayout

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Backend

Assembly of small modules

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Devices

Device characterization

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WaferTest

Testing

  • Standard characterization at chip level up to 20kV / 10A DC or pulsed mode up to 300A
  • Dynamic tests at module level
  • Evaluation and simulation of thermal properties (Rth, Zth)
  • End of life tests