Packaging Process - Die and wire bonding
- Module design, DCB layouts, module assembly
- Intended to offer solutions for application related tests (e.g. transient analysis, surge mode operation)
- Small quantities of customized modules
- Automated pick and place tools, able to process virtual ink matrix for selecting chips into groups with special parameters
- For larger quantities cooperation with leading packaging experts
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Main cooperation Partners for Backend solution : Semikron (D) Infineon (D) Others depending on the packaging requirements of our customers |
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