The use of SiC devices offers tremendous technical advantages, however, the device costs are very high and must be compensated by savings at system level or by offering performance advantages at system level a customer is eager to pay for. It must be stated that earlier visions of a replacement of silicon in power electronics by SiC devices is far away from reality. However, first components penetrated the market and were a precondition of trendsettting solutions (e.g. CCM PFC). Future potential applications will be mainly in the field of efficency driven systems (UPS, Solar). Additional huge steps are expected from cost reductions in the future as well as from progress in packaging technology for offering high temperature solutions. Especially the last mentioned enabling technology will be a precondition to enter segments where silicon cannot compete because of its physical limitations. By addressing these fields it will alos be possible to gain enough information about reliability in order to be ready to fulfill the high demands of outomotive applications, where a commercial use can be expected on a long term frame.